Dynamic, self consistent electro-thermal simulation of power microwave devices including the effect of surface metallizations

We present an efficient simulation technique to account for the thermal spreading effects of surface metallizations in the self-consistent dynamic electro-thermal analysis of power microwave devices. Electro-thermal self-consistency is achieved by solving the coupled nonlinear system made of a temperature dependent device electrical model, and of an approximate description of the device thermal behavior through a thermal impedance matrix. The numerical solution is pursued in the frequency domain by the Harmonic Balance technique. The approach is applied to the thermal stability analysis of power AlGaAs/GaAs HBTs and the results show that metallizations have a significant impact on the occurrence of the device thermal collapse.